User manual QUANTUM 8181148A02

[. . . ] SDLT 220 and SDLT 320 Design & Integration Guide Copyright Copyright © 2004 by Quantum Corporation. Document Origination: Boulder, Colorado, USA. Trademarks Quantum, the Quantum logo, and the DLTtape logo are trademarks of Quantum Corporation registered in the U. S. A. DLTtape, DLTSage, Value DLTtape, and Super DLTtape are trademarks of Quantum Corporation. Other company and product names used in this document are trademarks, registered trademarks, or service marks of their respective owners. Legal Disclaimers The information contained in this document is the exclusive property of Quantum Corporation. [. . . ] The drive is also able to power up and perform successfully with rise times of up to 11 seconds on either the 5V and the 12V supply (while the other is stable). 81-81148-01 March 2004 3-3 CHAPTER 3: Electrical Specifications SDLT 220 and SDLT 320 Design & Integration Guide 3. 2. 4 Supply Transient Voltage Allowable power supply transient voltage is: · · 5 Volt rail ­ 60 mV (peak to peak) 12 Volt rail ­ 1. 6 V (peak to peak). 3-4 March 2004 81-81148-01 CHAPTER 4 Thermal Specifications 4. 1 Over Temperature Condition This chapter presents the results of extensive experimentation and measurements of drive temperatures, and the resultant impact on SDLT 220/320 drive performance. An Overtemp condition is defined to be when the calculated Tape Path Temp = 52 degrees C. At that point, the tape is rewound, unloaded, and ejected if not in a library. CAUTION: Although the Overtemp condition occurs when the Tape Path Temp = 52 degrees C, Quantum recommends the operating environment of the drive be maintained such that the temperature of the tape path not exceed 50 degrees C; this provides a 2 degrees C margin of safety. The front temperature sensor is the point used to calculate drive temperature (even though it is not the hottest point inside the drive). The calculated Tape Path Temp for the SDLT 220/320 drive is derived using the following formulas: · · Embedded bezel Tape Path Temp = Front Sensor Temp + 3 degrees C Library bezel Tape Path Temp = Front Sensor Temp + 6 degrees C If not in a library, and if the drive temperature exceeds the operating threshold, any current tape operation is aborted, the tape is rewound, unloaded, and ejected from the drive. SCSI status then indicates that the drive is in the over temperature condition. 81-81148-01 March 2004 4-1 CHAPTER 4: Thermal Specifications SDLT 220 and SDLT 320 Design & Integration Guide If a SCSI command is aborted as a result of the over-temperature condition, the drive returns status of: Hardware Error, Warning -- Specified Temperature Exceeded (04h, 0Bh, 01h). 4. 2 Air Flow Measurements Air flow is measured in the location shown in Figure 4-1. At the specified location, the air flow needs to be at least 125 LFM (linear feet per minute). Alternatively stated, the air flow needs to be at least 7. 2 CFM (cubic feet per minute) for tape drives outfitted with library bezels. Measure Air Flow Inside the Gray Area Figure 4-1. Library Bezel--Where to Measure Air Flow 4-2 March 2004 81-81148-01 SDLT 220 and SDLT 320 Design & Integration Guide CHAPTER 4: Thermal Specifications 4. 3 Thermal Measurement Locations The Electronics Interface Module (EIM) comprises two boards: the Integrated Controller Module (ICM) board, and the Host Interface Module (HIM) board. Temperatures are measured on the ICM board in the locations shown in Figure 4-2, on the HIM board on the Qlogic chip shown in Figure 4-3, and on the drive's front bezel in the locations shown in Figure 4-4. NOTE: While the most critical temperatures are usually found along the tape path, data for other key areas inside the drive, such as the processor and other important circuits and chips that are known to produce heat, are included as well. 81-81148-01 March 2004 4-3 CHAPTER 4: Thermal Specifications SDLT 220 and SDLT 320 Design & Integration Guide 3. 3 ­ 5. 0V Voltage Regulator HiFN XEZ Coldfire Rear Thermal Sensor Hydra (back) Mac Front Thermal Sensor Figure 4-2. ICM Board Thermal Measurement Locations 4-4 March 2004 81-81148-01 SDLT 220 and SDLT 320 Design & Integration Guide CHAPTER 4: Thermal Specifications Qlogic Figure 4-3. HIM Board Thermal Measurement Location 81-81148-01 March 2004 4-5 CHAPTER 4: Thermal Specifications SDLT 220 and SDLT 320 Design & Integration Guide Hd Bd Thermal Sensor Media Temp Sensor Figure 4-4. Tape Path Thermal Measurement Locations 4. 4 SDLT 220/320 Thermal Profile This section lists the temperature of key module components and media at the extremes of the SDLT 220/320 operating specification as well as at room temperature. NOTE: The information in this thermal profile section is not intended to serve as a temperature specification, nor is it intended to replace the temperature specifications of individual chips or chipsets. This information is provided by Quantum solely as a guideline, and is representative of temperatures that you can expect to observe during typical tape drive operation. 4-6 March 2004 81-81148-01 SDLT 220 and SDLT 320 Design & Integration Guide CHAPTER 4: Thermal Specifications To evaluate different modes of operation, data was recorded either with data compression enabled or disabled. Thermocouples were affixed to key board components as shown in Figure 4-2. In addition, a thermocouple was placed within the tape path enclosure to monitor the approximate temperature of the media, as shown in Figure 4-4. The results of the testing are listed in Table 4-1 and Table 4-2 below. Table 4-1. SDLT 220/320 Steady State Temperatures: Embedded Bezel 10 degrees C Ambient Compression 2:1 On Off 25 degrees C Ambient Compression 2:1 On Off 40 degrees C Ambient Compression 2:1 On Off Component Case Maximum * Continuous Operating Temperature (degrees C) Temperature (degrees C) 1 2 3 4 5 6 7 8 9 10 * Temperature (degrees C) 57. 4 61. 3 57. 6 38. 5 49. 4 32. 0 50. 2 47. 7 45. 3 34. 6 55. 0 62. 0 58. 5 38. 5 48. 8 32. 0 49. 9 48. 4 45. 0 34. 7 Temperature (degrees C) 72. 5 77. 4 73. 6 53. 6 64. 7 47. 0 65. 8 62. 8 60. 9 50. 3 69. 6 76. 9 73. 2 53. 5 63. 8 47. 0 64. 7 62. 7 60. 1 50. 2 96 113 113 83 119 52 125 125 80 n/a HiFN Hydra 1 Hydra 2 Coldfire 3. 3-5. 0 V Reg Front Sensor Rear Sensor Headboard Qlogic 42. 4 45. 8 42. 3 23. 3 34. 2 17. 0 35. 2 33. 2 29. 7 39. 9 46. 5 42. 9 23. 4 33. 4 17. 0 34. 3 33. 9 29. 3 19. 6 Media Sensor (Heads) 19. 3 The number in the Case Maximum Continuous Operating Temperature column are absolute limits that should not be exceeded. In other words, expect physical component damage or failure if you exceed these operating temperature limits by not providing adequate air flow through the drive. 81-81148-01 March 2004 4-7 CHAPTER 4: Thermal Specifications SDLT 220 and SDLT 320 Design & Integration Guide Table 4-2. SDLT 220/320 Steady State Temperatures: Library Bezel 10 degrees C Ambient Compression 2:1 On Off 25 degrees C Ambient Compression 2:1 On Off 40 degrees C Ambient Compression 2:1 On Off Component Case Maximum * Continuous Operating Temperature (degrees C) Temperature (degrees C) 1 2 3 4 5 6 7 8 9 10 * Temperature (degrees C) 52. 1 54. 1 51. 2 35. 8 44. 1 29. 0 44. 0 46. 4 40. 3 34. 5 49. 7 54. 4 51. 5 35. 8 43. 5 29. 0 43. 9 46. 9 39. 9 34. 5 Temperature (degrees C) 66. 5 68. 5 65. 8 50. 8 59. 0 44. 0 59. 0 60. 2 55. 4 49. 3 64. 6 69. 5 66. 6 50. 9 58. 7 44. 0 58. 9 61. 2 55. 2 49. 6 96 113 113 83 119 52 125 125 80 n/a HiFN Hydra 1 Hydra 2 Coldfire 3. 3-5. 0 V Reg Front Sensor Rear Sensor Headboard Qlogic 37. 3 38. 6 35. 8 20. 8 29. 1 14. 0 29. 1 31. 7 25. 0 34. 7 39. 2 36. 4 20. 6 28. 3 14. 0 29. 0 32. 5 24. 6 19. 3 Media Sensor (Heads) 19. 2 The number in the Case Maximum Continuous Operating Temperature column are absolute limits that should not be exceeded. [. . . ] Do not press unevenly (or asymmetrically) on the cartridge, because it can cause premature wear to internal mechanical components. Insertion Velocity The insertion velocity must be in the range: 0 < velocity 1. 5 inch/sec. 81-81148-01 March 2004 8-5 CHAPTER 8: Insertion and Extraction Guidelines SDLT 220 and SDLT 320 Design & Integration Guide Hold Time for Loading (Dwell Time) When loading the cartridge into the drive, the maximum time that the picker should hold the cartridge is 250 ms (0. 25 second). If a longer hold time is used, buckling and possible reel driver engagement problems could occur. Debounce Time The time allowed for the tape to stop moving (delay after insertion) is 50 ms. Initialization Time Initialization time is the maximum time for the SDLT 220/320 drive to come ready after cartridge load; the time necessary for the drive to "ready itself" varies according to the characteristics and history of the media: · Blank Media (never been written or degaussed): Typically when a blank media is inserted into the drive, the drive completes its algorithms for cartridge load within 1 ½ minutes. (This worst case time includes all of the error recovery algorithms that may need to be invoked. ) Written Media: Typically when a written media is inserted into the drive, the drive completes its algorithms for cartridge load within 15 seconds. · 8. 3 Unloading a Tape Cartridge (Standard Configuration) Complete this subsection to unload a tape cartridge. Because this subsection of the manual refers to some of the front panel LEDs and controls, it describes the process for manually unloading a tape cartridge. [. . . ]