User manual LEICA EM TXP BROCHURE

[. . . ] Leica EM TXP Target Surfacing System Leica EM TXP ­ Target Surfacing The Leica EM TXP is a unique target preparation device especially developed for cutting and polishing samples prior to examination by SEM, TEM and LM techniques. It excels with challenging specimens where pinpointing and preparing barely visible targets becomes easy. [. . . ] This prevents access to moving parts and avoids particulate matter escaping. During milling a low-noise extraction and filtration unit with a Hepa filter (optional) provides a safe, dust-free environment. Diamond and tungsten carbide millers Diamond disc cutter Lapping inserts 15, 9, 6, 3, 1, 0. 5 m 4 Integrated Automatic Process Control Let the Leica EM TXP do the job The Leica EM TXP automatic process control mechanism saves you from time-consuming routine sample preparation: ­ with the automatic E-W guiding mechanism ­ with the force-regulated feed control ­ with the countdown function and level sensor for the integrated lubricant cooling system ­ Pivot arm lever ­ Hand wheel for manual feed in steps of 0. 5, 1, 10 and 100 m ­ Control panel for manual operation and setting of all parameters for automatic preparation Peristaltic cooling system Peristaltic cooling system E-W guiding mechanism 5 Application Examples Target preparation on surfaced sample for incident light LM and SEM All processing steps are carried out consecutively on the Leica EM TXP without removing the sample for pinpointing the area of interest via another microscope or for making any adjustments. Preparing specimens observed during operation with the integrated stereo microscope avoids the time consuming interruption of locating the target with a stand alone microscope and then re-aligning the sample in the polishing instrument. Sawing Observation via stereo microscope of the Leica EM TXP Sample Thinning for transmitted light LM or prior to ion thinning for TEM Specimen thinning with the Leica EM TXP offers the advantage of observing the complete process during treatment and distance monitoring at each process step without the need to remove the sample for checking in another instrument. 1st side preparation as described above. Mill a supporting stub with the disc cutter so it is parallel to the prepared face in step 1. Fix the prepared 1st side with wax onto the prepared stub without removing it from the holder. Or directly in the Leica EM TXP with glue. 6 Grinding/polishing The area of interest via the stereo microscope of the Leica EM TXP The saw is set to the desired value (e. g. The thickness of the sample can be observed on the advance counter display. Here the sample thickness is 25 m. 7 IC: Silicon soldered on copper paddle Result: Target-prepared integrated circuit. Gold wire bonding on Si (LM image) Incident light Incident and transmitted light Transmitted light Result: Target prepared integrated circuit. 25 m section (LM image) 8 View the Details Leica Microsystems ­ the brand for outstanding products Leica Microsystems' mission is to be the world's first-choice provider of innovative solutions to our customers' needs for vision, measurement and analysis of microstructures. [. . . ] With confocal laser technology and image analysis systems, we provide three-dimensional viewing facilities and offer new solutions for cytogenetics, pathology and materials sciences. · Specimen Preparation We provide comprehensive systems and services for clinical histo- and cytopathology applications, biomedical research and industrial quality assurance. Our product range includes instruments, systems and consumables for tissue infiltration and embedding, microtomes and cryostats as well as automated stainers and coverslippers. and representatives of Leica Microsystems in more than 100 countries. · Medical Equipment Innovative technologies in our surgical microscopes offer new therapeutic approaches in microsurgery. www. leica-microsystems. com Leica EM TXP - E - 6/07 Order No. [. . . ]