User manual IBM XSERIES 255 TYPE 8685

[. . . ] ERserver xSeries 255 Type 8685 Hardware Maintenance Manual and Troubleshooting Guide ERserver xSeries 255 Type 8685 Hardware Maintenance Manual and Troubleshooting Guide Note Before using this information and the product it supports, be sure to read Appendix C, "Notices, " on page 209. 14th Edition (June 2005) The following paragraph does not apply to the United Kingdom or any country where such provisions are inconsistent with local law: INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION AS IS WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you. This publication could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. [. . . ] Turn the DIMM so that the DIMM keys align correctly with the connector. Be sure that the retaining clips snap into the closed positions. Chapter 4. If a gap exists between the DIMM and the retaining clips, the DIMM has not been properly installed. In this case, open the retaining clips and remove the DIMM; then, reinsert the DIMM. Close the memory-board airflow guide and press the Velcro tabs together to secure the airflow guide to the memory-board assembly. Airflow guide velcro retention tabs Release latch Memory board Release latch Memory-board airflow guide (closed position) Memory-board airflow guide (open position) 14. Make sure that the release latches are in the open position before you install the memory-board assembly in the server. Align the memory-board assembly into the card guides and over the memory-board connector. Align the holes on each side of the memory-board bracket over the corresponding alignment pins on the chassis; then, slide the memory-board bracket over the alignment pins. The left alignment pin is located between the air baffle and the center internal fans. The right alignment pin is located between the air baffle and the rear internal fans and the adapter slots. Close (to the locked position) the release latches to seat the memory board in the connector. Notes: 1) To ensure proper server operation, make sure that the memory-board airflow guide is in the closed position. 2) When installing the memory board, make sure that the memory board airflow guide is positioned in between the VRMs and the heat sinks. Firmly press the memory-board assembly down into the connector until it snaps into place. Align and insert the two tabs on the rear of the air baffle into the corresponding slots on the rear of the server. 86 xSeries 255 Type 8685: Hardware Maintenance Manual and Troubleshooting Guide b. Align the hole on the front of the air baffle over the corresponding alignment pin on the chassis; then, lower the air baffle into place. Note: The alignment pin is located near the plastic fastener behind fan 1. Press firmly on the two plastic fasteners until they snap into place on the front of the air baffle. If you have other options to install or remove, do so now; otherwise, go to "Completing the installation" on page 104. Note: When you restart the server, the system displays a message indicating that the memory configuration has changed. v If you installed additional memory, the Configuration/Setup Utility program automatically saves the new configuration information. v If you just replaced a failed DIMM, you must start the Configuration/Setup Utility program, select Advanced Setup, select Memory Settings, highlight the DIMM or pair or quad of DIMMs that you want to enable, and then select Enable (see "Starting the Configuration/Setup Utility program" on page 11). [. . . ] IBM makes no representations or warranties with respect to non-IBM products. Support (if any) for the non-IBM products is provided by the third party, not IBM. Some software may differ from its retail version (if available), and may not include user manuals or all program functionality. Product recycling and disposal This unit contains materials such as circuit boards, cables, electromagnetic compatibility gaskets, and connectors which may contain lead and copper/beryllium alloys that require special handling and disposal at end of life. Before this unit is disposed of, these materials must be removed and recycled or discarded according to applicable regulations. [. . . ]