User manual CADENCE DESIGN SYSTEMS CADENCE 3D DESIGN VIEWER DATASHEET

[. . . ] CAD E N C E 3 D D E S I G N V I E W E R VISU A L I Z E , D E B U G , A N D V E R I F Y COM P L E X I C PA C K A G E S DATASHEET AN INTELLIGENT 3D DESIGN VIEW Virtually all of today's EDA tools that perform physical layout--IC, IC package, or PCB--are two-dimensional. While 2D may work fine for substrate layout, interconnect planning, or metal fill creation, this "plane-view" does not lend itself well to the design, management, and verification of multi-tier wirebond die or stacked-die designs. [. . . ] For demonstration purposes a stacked die design using four die on ball grid array (BGA) substrate is used. The base die is flip-chip attached; the top three die are wirebond attached. In the 2D editor view (Figure 2), visualizing and validating the die stack and the wirebond ring is challenging, even for a seasoned package designer. And, due to the complexity, it would be almost impossible to hold a design review with an architect or lead engineer. When the same design is loaded into the 3D Design Viewer (Figure 1) the designer and the engineering team can not only easily visualize, investigate, and create collaborative. markups but they can also perform detailed 3D wirebond checking, including the ability to define, modify, and assign new wirebond profiles. Figure 2: A multi-die stack on a BGA substrate viewed in 2D the highlight color and the level of transparency applied to none selected objects. The 3D Viewer is especially effective when trying to understand and visualize complex via arrays, especially on designs using build-up layers. Figure 3 illustrates how difficult it is to understand the connectivity path of high density interconnect (HDI) from a top package substrate layer to a bottom layer viewed in 2D. The designer can easily visualize the interconnect path from the top to the bottom layer. EASY DESIGN INVESTIGATION Cross referencing is easy as the 3D Design Viewer uses the same color/layer/object settings as defined in Allegro Package Designer. For detailed design investigation, the 3D Viewer has similar "show element" information command capability that can be used by "object" or by "net. " Importantly, the user has control over Figure 3: It is difficult to understand the connectivity path between the metal interconnect as it transitions between layers in 2D www. cadence. com 3D DESIGN VIEWER 2 ADVANCED FEATURES When preparing for 3D viewing in SiP Layout or APD, it may be desirable to focus on a sub-section of the package. For this reason, the user is offered the option of taking a section of the package and viewing that piece in the 3D viewer. This can be particularly useful in design reviews where a section of the design is being examined. Another useful feature is the ability to append multiple designs within one single 3D view. This is commonly used with Package-on-Package (PoP) designs or in cases where a multiple routing substrates are used within a single package. INTERACTIVE MARKUP During 3D design viewing an engineer can create "markup" jpeg snapshots for design reviews and/or design documentation that include the ability to add basic shapes, arrows and text. [. . . ] 3D visualization lets you see precisely where 3D spacing rules are violated. For more information contact Cadence sales at: +1. 408. 943. 1234 or log on to: www. cadence. com/ contact_us © 2010 Cadence Design Systems, Inc. Cadence, the Cadence logo, and Allegro are registered trademarks of Cadence Design Systems, Inc. [. . . ]